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  1. Fraunhofer IZM Assembly and Packaging Technologies for Microsystems

    The Fraunhofer IZM is one of the leading institutes for product-focused development of advanced packaging technologies for microelectronics and microsystems ...
    Design7
    Packaging3
    Advanced3
    Technologies3
    Simulation2
    Chip2
    Reliability2
    Composites2
    Environmental Engineering1
    Failure Analysis1
    photonics1
    Microelectronics1
    Microsystems1
    Mechatronics1
    Bumping1
    Polymer Materials1
    High Density Interconnect1
    Microelectronic Packaging1
    eGrain1
    Board Interconnection0
    e-Grain0
    Fraunhofer IZM0
    Micromechanical Systems0
    Waferlevel0

    www.izm.fhg.de - 2009-01-28

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